Cadence Sigrity and Systems Analysis 2021.1 HF005 (21.10.500) Linux

Posted on 30 Oct 19:29 | by Apple | 1 views
Cadence Sigrity and Systems Analysis 2021.1 HF005 (21.10.500) Linux
Free Download Cadence Sigrity and Systems Analysis 2021.1 HF005 Linux | 19.6 Gb
Owner:Cadence Design Systems
Product Name:Sigrity and Systems Analysis
Version:2021.1 HF005 (21.10.500)
Supported Architectures:x86_64
Website Home Page :www.cadence.com
Languages Supported:english
System Requirements:Linux *
Size:19.6 Gb
Cadence Design Systems, Inc., a leader in global electronic design innovation, is pleased to announce the availability ofSigrity and Systems Analysis 2021.1 HF005 (21.10.500)is a supplier of software for IC package physical design and for analyzing power integrity and signal integrity.


Sigrity and Systems Analysis 2021.1 Release - Date: 19 Feb 2021
SIGRITY Release Renamed as SIGRITY/SYSANLS
The SIGRITY release is now known as SIGRITY/SYSANLS. SYSANLS stands for Systems Analysis and includes the Clarity 3D Solver and Celsius Thermal Solver products. The Systems Analysis products complement Sigrity tools and are focused on complete systems. Thermal, EMI, RF, and extraction simulations include design data beyond ECAD and often include MCAD components such as antennas, cables, connectors, and enclosures. The new release name signifies that SIGRITY and SYSANLS are two separate releases bundled as one media.
Note:The SIGRITY/SYSANLS 2021.1 release requires the installation of the latest OrCAD/Allegro 17.4 (SPB174) Hotfix release as well.
Clarity 3D Solver
-Far-field Processing Enhanced:The performance of far-field processing has been improved significantly. Now, you can load and view the results for large designs much faster.
-New Geometry Healing Options Added:Clarity 3D Workbench now provides a couple of new options that enable you to remove or repair the bad faces of a geometry that are introduced when importing a design.
-Support for New Boundary Conditions Added:Two new boundary conditions, impedance boundary and RLC boundary, have been added in Clarity 3D Workbench. The impedance boundary condition is used to model the resistive surfaces while the RLC boundary condition is used to model lumped resistors, inductors, and capacitors.
-Pre-simulation Validation Enhanced:Pre-simulation validation has been enhanced in both Clarity 3D Workbench and Clarity 3D Layout. Both the tools now perform extensive checks during pre-simulation validation so that most of the errors can be detected and resolved prior to running the simulation.
-Adaptive Mesh Refinement Stage Improved:The mesh refinement priority and the mesh quality have been improved in the adaptive mesh refinement stage that results in a more stable convergence trend and a more reliable final mesh.
New Clarity 3D Transient Solver Introduced
A new Finite Difference Time Domain (FDTD) solver, Clarity 3D Transient Solver, has been introduced that enables you to obtain results for a wide frequency band with a single simulation run as compared to other frequency domain solvers that require multiple runs for several frequencies.
Celsius Thermal Solver
-Different Initial Conditions for Different Objects:In Celsius Solid Objects Simulation for 3D Structures and Celsius Fluid Flow Simulation modules, instead of specifying a uniform initial (ambient) temperature for the entire project, you can now specify different initial temperature values for different objects in the design. During analysis, such objects are initialized at the specified temperature value instead of the ambient temperature used for the rest of the project.
-Support for Nonlinear Material Properties in the Material Library:You can now define materials with nonlinear properties, such as, viscoplasticity, fatigue, and failure in Celsius. This helps you study the structural response of your design when using materials with a nonlinear stress-strain relationship.
-Defining Structural Load as Boundary Conditions:You can now perform structural load analysis of your design by specifying nodal and surface loads as boundary conditions in Celsius Solid Objects Simulation for 3D Structures module. This can help you study the effect of different loads on the deformation of materials and its impact on the simulation.
-Time-dependent Ambient Temperature Support:For transient analysis in Celsius Fluid Flow Simulation module, instead of defining a constant ambient temperature for the entire simulation, you can now define time-dependent ambient temperature. This option helps model the scenarios where the ambient temperature can vary with time.
-Time-dependent Flow Rate and Flow Temperature Support:In the Celsius Fluid Flow Simulation module, you can now define time-dependent flow rate and flow temperature for an opening on the chassis wall. This helps you model more realistic scenarios, where the opening's inlet flow rate and/or temperature can vary with time.
-2D and 3D Probes Support in Celsius Fluid Flow Simulation:You can now add 2D and 3D probes in the Celsius Fluid Flow Simulation module to collect the 2D and 3D probe data. 3D probes collect the maximum, minimum, and average temperature data, while 2D probes collect the mean temperature in, mean temperature out, and net flow data. After the simulation run, you can use the probing data to analyze the results.
-Filtering, Sorting, and Exporting Result dаta:Celsius supports filters to refine the results displayed in the Results Report tab after a simulation run. You can also sort the results using the up and down arrows. Results from the results table can then be exported to other applications such as Microsoft Excel using the copy (Ctrl+C) and paste (Ctrl+V) options.
-Post Processing Enhancements:You now have the ability to post process your simulation results within the Celsius Thermal Solver interface. Celsius lets you Description your simulation results in a new ParaView instance within the Layout pane. This capability is available through the Field-Description option in both Celsius Solid Objects Simulation for 3D Structures and Celsius Fluid Flow Simulation modules.
New Unified GUI Platform Introduced
A new unified GUI platform is now available for Clarity 3D Workbench, Celsius Thermal Solver, and Clarity 3D Transient Solver tools. You can now access these tools from a single GUI, and also easily switch from one tool to another without the need to open the tool separately.
SystemSI Migrated to a New User Interface
SystemSI has been migrated to a new user interface. To continue using the extensive features of SystemSI, install the latest versions of the following two releases from
https://downloads.cadence.com
:
- OrCAD/Allegro 17.4 (SPB174) HotFix
- SIGRITY/SYSANLS 2021.1
On Windows, open the new SystemSI from the Cadence System Analysis folder in the Start menu.
New SPEEDEM Tool Introduced
SPEED2000 is now known as SPEEDEM. SPEEDEM comes with complete support for rigid-flex designs including cross-hatch planes and multi-zone stackups, enhanced time domain engine performance, and ERC modularization.
Sigrity Suite Renamed to Layout Workbench
Sigrity Suite is now known as Layout Workbench. In this release, the following tools have been added to Layout Workbench:
- Celsius Layout
- OptimizePI
- PowerDC
Note:Clarity 3D Layout, PowerSI, and XtractIM are already a part of Layout Workbench.
All Layout Workbench tools now come in a new, dark-themed interface that gives them a new visual appeal. However, if you prefer the light theme, you can change it from the Themes tab in the Options form.
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CCRID Product Title
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2612050 ASI_SI Tag xHatch polygons during translation from brd to spd
2567736 POWERDC PowerDC II gives different via current compared to PowerDC I
2572770 POWERSI PowerSI ERC simulation exits unexpectedly
2585023 SIGRITY_SUITE Clarity 3D Layout exits unexpectedly when running the Tcl command 'sigrity::flip -z'
2588894 SIGRITY_SUITE The simulation exits unexpectedly during mesh generation
2582185 TRANSLATOR Unable to translate layout using PowerSI, but no issues in SPDLinks
2583631 XCITEPI XcitePI exits unexpectedly when generating a ckt model
Cadence Sigrityprovides a rich set of gigabit signal and power network analysis technologies, including a unique power-aware signal integrity analysis capability for system, printed circuit board (PCB), and IC package designs. The combination of Sigrity analysis technologies with Cadence Allegro and OrCAD design tools will provide a comprehensive front-to-back integrated flow to enable system and semiconductor companies to deliver high-performance devices employing gigabit interface protocols such as DDR and PCI Express. The integrated solution will particularly benefit customers delivering electronic systems in high-growth markets such as mobile multimedia devices and cloud computing infrastructure.
Systems Analysisproducts complement Sigrity tools and are focused on complete systems. Thermal, EMI, RF, and extraction simulations include design data beyond ECAD and often include MCAD components such as antennas, cables, connectors and enclosures.
Cadence Sigrity: How to Avoid Power Delivery Problems in your PCBs
Ensure uniform current density in your design and put a stop to the additional time and money spent on troubleshooting hard to find power delivery network issues in the lab with Allegro In-Design Analysis powered by Sigrity.
Cadenceis a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world's most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For eight years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work.





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